PCB

Rigid, Flex, Rigid-Flex

Baixa, média e alta complexidade

High Density Interconnection (HDI)

Materiais base de alta performance

Complex designs for Signal Integrity, High Speed and RF

Design for Thermal Performance

Acabamentos HAL, Ag, Tin, Gold, Organic, outros

Capacidades: gold finger, carbon ink, via-in-pad, backdrilling, laser drilling, impedance control, heatsink

Others special requirements.